ET 2019 & IoT Technology 2019
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EDA Electronic Design & EDA Track

組込み機器開発の基となる、半導体設計にフォーカスした専門トラックです。半導体設計を支える最先端の協調設計、検証手法、技術トレンドをカバー、UML、RTL、UVM、MBD、LPB、IoT...氾濫する3文字略号も分かり易く解説、半導体設計者だけではなく、半導体ユーザも必見の内容が盛り沢山です。

EDA-1
Nov 21 (Thu)
10:30〜13:00
Exhibition Hall / Seminar Venue D

10:30〜11:00 Zero-respin product development and multi-enterprise concept co-design

Nobuo Nakane

Specialist, Smart Peripheral Business Center Office Printing Development Division, RICOH COMPANY, LTD.

11:00〜11:20 Development of collaborative design environment using private cloud technology Realization of a cloud-based electronic device design environment with improved security

Yoshio Inoue

CEO & CTO, CDC, Inc.

11:20〜11:40 Physical planning in co-design PCB/PKG data exchange between companies today

Hiroshi Murata

President, Gem Design Technologies, Inc.

11:40〜12:00 Case study of IP/LSI development using "UML to RTL technology" Improve maintenance and reusability of design data and useful for collaborative design

Yoshihiro MATSUMOTO

Senior Manager, Business Planning Department, Overtone Corporation

12:00〜12:20 FPGA Co-Design and Co-Verification Introduce Method for "Shift Left" and "Pursue Quality"

Tomofusa Nomura

Manager, Design Service Business Unit SoC Design Department, CM Engineering Co.,Ltd

12:20〜12:40 Easy to build The best of prototyping system

Tomoyuki Tsuji

S2c Japan K.K.

12:40〜13:00 Embedded Software Verification for HW/SW collaborative Development Effectiveness of software virtual verification on SystemC platform

Hideaki HONTAO

InterBuddy Inc.
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