ET 2018 & IoT Technology 2018
Exhibitor information

JIEP/Study Group of Boundary-Scan

Booth No.

[Co-design tools][Test and verification services][Local Goverments/ Community Action Organizations ]

Exhibit Highlights

The Boundary Scan Study Group of Electronics Packaging Association will expand the boundary scan in Japan and contribute to strengthening the competitiveness of Japanese electronic manufacturing industry.
With the arrival of the IoT era, electronic circuits have been mounted on everything, and further downsizing, high quality and reliability are required for electronic circuits. Also, the automation of electronic control has been rapidly advanced and the quality assurance of on-board electronic circuits is an important issue for safety.
In boundary scan, not only the interconnection test of the mounting board but also functions such as genuineness judgment of IC, on-board IC diagnosis of high speed (Gbit / s) and FPGA configuration have appeared and introduces the latest technology trends.
In addition, we will introduce the results of the latest boundary scan research at universities (Ehime Univ., Tokushima Univ., Tokai Univ.).
We also demonstrate the tools by cooperating with the boundary scan tool vendor (JTAG - Technologies, KeySight, Zuken).

Applicable field

  • Automotive
  • Consumer electronics / AV / Amusement
  • New communication / Mobile / Network
  • FA
  • Smart Energy
  • Social Infrastructure
  • Medical / Nursing care
  • Logistics
  • Agriculture / Fisheries / Mining
  • Aerospace
  • Finance (bank / securities / insurance)


3-12-2 Nishigihoku Suginami-ku, Tokyo, 167-0042