ET 2018 & IoT Technology 2018
Exhibitor
Exhibitor information

Winbond Electronics Corp.Japan

Booth No.
A-10

[IoT Device Semiconductors]

Exhibit Highlights

Winbond is a specialty memory IC company engaged in design, manufacturing and sales services, and endeavors to provide its global clientele top quality low to medium density memory solutions.
Our major product lines include Code Storage Flash Memory, Specialty DRAM and Mobile DRAM.
In the area of Code Storage Flash Memory products, we focus on the “low to medium density” market by offering a full spectrum of Serial Flash and Parallel Flash products. Our Flash memory packages offer features such as low pin count, small size and low cost.At this exhibition, we will introduce new products for IoT era, Secure Flash and low voltage flash memory, please visit our booth!

Applicable field

  • Automotive
  • Consumer electronics / AV / Amusement
  • New communication / Mobile / Network
  • FA
  • Smart Energy
  • Social Infrastructure
  • Medical / Nursing care
  • Logistics
  • Agriculture / Fisheries / Mining
  • Aerospace
  • Finance (bank / securities / insurance)

Contact

Address
Shin-Yokohama Square Bldg. 9F, 2-3-12 Shin-Yokohama, kouhoku-ku, Yokohama, Kanagawa, Japan
TEL
+81-45-478-1883
FAX
+81-45-478-1800
URL
http://www.winbond.com
Email
ryukutake@winbond.com

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